-
ManufacturerAbracon LLC (3)Cypress Semiconductor Corp (1)Epson (2)Microchip Technology (93)Silicon Labs (1)
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Additional FeatureSTANDBY; ENABLE/DISABLE FUNCTION; 2.5V 3.3V ARE AVAILABLE; TAPE AND REEL (1)
-
Available Frequency Range1MHz~100MHz (3)1MHz~150MHz (17)
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Base ResonatorMEMS (20)
-
Current - Supply (Disable) (Max)12u03bcA (3)15u03bcA (14)1u03bcA (3)
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Current - Supply (Max)3mA Typ (3)10mA (3)
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Factory Lead Time12 Weeks (19)
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Fall Time-Max3ns (14)
-
Frequency150MHz (16)
-
Frequency Adjustment-MechanicalNO (1)
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Frequency Stabilityu00b125ppm (6)50 ppm (2)25 ppm (6)10 ppm (6)
-
FunctionStandby (19)Standby (Power Down) (1)
-
Height889u03bcm (17)
-
Height Seated (Max)0.035 0.90mm (18)0.035 0.89mm (2)
-
JESD-609 Codee4 (13)
-
Length7.0104mm (1)5.0038mm (1)2.4892mm (1)
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Load Capacitance15pF (16)
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Max Duty Cycle55 % (16)
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Max Operating Temperature85u00b0C (3)
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Max Supply Current12.2mA (14)10mA (3)
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Max Supply Voltage3.6V (3)
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Min Operating Temperature-40u00b0C (3)
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Min Supply Voltage1.65V (3)
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Moisture Sensitivity Level (MSL)1 (Unlimited) (18)3 (168 Hours) (2)
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MountSurface Mount (17)
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Mounting TypeSurface Mount (20)
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Number of Pins4 (6)
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Operating Frequency (Max)150MHz (1)
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Operating Frequency-Min1MHz (1)
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Operating Supply Voltage3.3V (16)
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Operating Temperature-20u00b0C~70u00b0C (2)-40u00b0C~85u00b0C (12)-40u00b0C~105u00b0C (6)
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OutputCMOS (20)
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Package / Case4-SMD, No Lead (19)4-SMD, No Lead Exposed Pad (1)
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PackagingBulk (2)Tape & Reel (TR) (3)Tube (15)
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Part StatusActive (20)
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Pbfree Codeyes (3)
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Physical Dimension7.0mm x 5.0mm x 0.85mm (4)5.0mm x 3.2mm x 0.85mm (4)3.2mm x 2.5mm x 0.85mm (4)2.5mm x 2.0mm x 0.85mm (2)
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Programmable TypeBlank (User Must Program) (20)
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Published2014 (2)2010 (1)2009 (4)2013 (1)
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RatingsAEC-Q100 (17)
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Rise Time-Max3ns (14)
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RoHS StatusROHS3 Compliant (20)
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SeriesDSC61XX (3)DSC8001 (14)DSC8002 (3)
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Size / Dimension0.126Lx0.098W 3.20mmx2.50mm (5)0.098Lx0.079W 2.50mmx2.00mm (4)0.079Lx0.063W 2.00mmx1.60mm (1)0.276Lx0.197W 7.00mmx5.00mm (5)0.197Lx0.126W 5.00mmx3.20mm (5)
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Supply Voltage1.8V (14)
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Symmetry-Max55/45% (8)
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Terminal FinishGold (Au) - with Nickel (Ni) barrier (1)Nickel/Palladium/Gold (Ni/Pd/Au) (12)
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TerminationSolder (16)
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TypeXO (Standard) (20)
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Usage LevelIndustrial grade (1)
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Voltage - Supply1.71V~3.63V (3)1.8V~3.3V (17)
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Width5.0038mm (1)3.2004mm (1)2.0066mm (1)
Attribute column
Categories
Programmable Oscillators
Product |
Inventory |
Pricing(USD) |
Quantity |
Datasheet |
RoHS |
Additional Feature |
Available Frequency Range |
Base Resonator |
Current - Supply (Disable) (Max) |
Current - Supply (Max) |
Factory Lead Time |
Fall Time-Max |
Frequency |
Frequency Adjustment-Mechanical |
Frequency Stability |
Function |
Height |
Height Seated (Max) |
JESD-609 Code |
Length |
Load Capacitance |
Max Duty Cycle |
Max Operating Temperature |
Max Supply Current |
Max Supply Voltage |
Min Operating Temperature |
Min Supply Voltage |
Moisture Sensitivity Level (MSL) |
Mount |
Mounting Type |
Number of Pins |
Operating Frequency (Max) |
Operating Frequency-Min |
Operating Supply Voltage |
Operating Temperature |
Output |
Package / Case |
Packaging |
Part Status |
Pbfree Code |
Physical Dimension |
Programmable Type |
Published |
Ratings |
Rise Time-Max |
RoHS Status |
Series |
Size / Dimension |
Supply Voltage |
Symmetry-Max |
Terminal Finish |
Termination |
Type |
Usage Level |
Voltage - Supply |
Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DSC6112CE2A-000.0000
Microchip Technology |
- |
- |
|
- |
- |
1MHz~100MHz |
MEMS |
12u03bcA |
3mA Typ |
12 Weeks |
- |
- |
- |
u00b125ppm |
Standby |
- |
0.035 0.90mm |
- |
- |
- |
- |
- |
- |
- |
- |
- |
1 (Unlimited) |
- |
Surface Mount |
- |
- |
- |
- |
-20u00b0C~70u00b0C |
CMOS |
4-SMD, No Lead |
Bulk |
Active |
yes |
- |
Blank (User Must Program) |
- |
AEC-Q100 |
- |
ROHS3 Compliant |
DSC61XX |
0.126Lx0.098W 3.20mmx2.50mm |
- |
- |
- |
- |
XO (Standard) |
- |
1.71V~3.63V |
- |
|
DSC6112JE2A-000.0000
Microchip Technology |
34 |
- |
|
- |
- |
1MHz~100MHz |
MEMS |
12u03bcA |
3mA Typ |
12 Weeks |
- |
- |
- |
u00b125ppm |
Standby |
- |
0.035 0.89mm |
- |
- |
- |
- |
- |
- |
- |
- |
- |
1 (Unlimited) |
- |
Surface Mount |
- |
- |
- |
- |
-20u00b0C~70u00b0C |
CMOS |
4-SMD, No Lead |
Bulk |
Active |
yes |
- |
Blank (User Must Program) |
- |
AEC-Q100 |
- |
ROHS3 Compliant |
DSC61XX |
0.098Lx0.079W 2.50mmx2.00mm |
- |
- |
- |
- |
XO (Standard) |
- |
1.71V~3.63V |
- |
|
DSC6112MI2A-000.0000T
Microchip Technology |
27 |
- |
|
- |
- |
1MHz~100MHz |
MEMS |
12u03bcA |
3mA Typ |
12 Weeks |
- |
- |
- |
u00b125ppm |
Standby |
- |
0.035 0.89mm |
e4 |
- |
- |
- |
- |
- |
- |
- |
- |
1 (Unlimited) |
- |
Surface Mount |
- |
- |
- |
- |
-40u00b0C~85u00b0C |
CMOS |
4-SMD, No Lead |
Tape & Reel (TR) |
Active |
yes |
- |
Blank (User Must Program) |
- |
AEC-Q100 |
- |
ROHS3 Compliant |
DSC61XX |
0.079Lx0.063W 2.00mmx1.60mm |
- |
- |
Gold (Au) - with Nickel (Ni) barrier |
- |
XO (Standard) |
Industrial grade |
1.71V~3.63V |
- |
|
DSC8001AI1
Microchip Technology |
1 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
50 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
e4 |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
- |
- |
- |
3.3V |
-40u00b0C~85u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
7.0mm x 5.0mm x 0.85mm |
Blank (User Must Program) |
2014 |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.276Lx0.197W 7.00mmx5.00mm |
1.8V |
55/45% |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001AI2
Microchip Technology |
710 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
25 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
e4 |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
- |
- |
- |
3.3V |
-40u00b0C~85u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
7.0mm x 5.0mm x 0.85mm |
Blank (User Must Program) |
2010 |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.276Lx0.197W 7.00mmx5.00mm |
1.8V |
55/45% |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001AL2
Microchip Technology |
50 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
- |
NO |
u00b125ppm |
Standby |
889u03bcm |
0.035 0.90mm |
e4 |
- |
- |
- |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
- |
150MHz |
1MHz |
- |
-40u00b0C~105u00b0C |
CMOS |
4-SMD, No Lead Exposed Pad |
Tube |
Active |
- |
7.0mm x 5.0mm x 0.85mm |
Blank (User Must Program) |
2009 |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.276Lx0.197W 7.00mmx5.00mm |
1.8V |
55/45% |
Nickel/Palladium/Gold (Ni/Pd/Au) |
- |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001AL5
Microchip Technology |
155 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
10 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
e4 |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
4 |
- |
- |
3.3V |
-40u00b0C~105u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
7.0mm x 5.0mm x 0.85mm |
Blank (User Must Program) |
2009 |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.276Lx0.197W 7.00mmx5.00mm |
1.8V |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001BI2
Microchip Technology |
1000 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
25 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
e4 |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
4 |
- |
- |
3.3V |
-40u00b0C~85u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
5.0mm x 3.2mm x 0.85mm |
Blank (User Must Program) |
- |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.197Lx0.126W 5.00mmx3.20mm |
1.8V |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001BI2T
Microchip Technology |
88 |
- |
|
- |
STANDBY; ENABLE/DISABLE FUNCTION; 2.5V 3.3V ARE AVAILABLE; TAPE AND REEL |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
u00b125ppm |
Standby (Power Down) |
889u03bcm |
0.035 0.90mm |
- |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
3 (168 Hours) |
Surface Mount |
Surface Mount |
- |
- |
- |
3.3V |
-40u00b0C~85u00b0C |
CMOS |
4-SMD, No Lead |
Tape & Reel (TR) |
Active |
- |
5.0mm x 3.2mm x 0.85mm |
Blank (User Must Program) |
2009 |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.197Lx0.126W 5.00mmx3.20mm |
1.8V |
55/45% |
- |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001BI5
Microchip Technology |
617 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
10 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
e4 |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
4 |
- |
- |
3.3V |
-40u00b0C~85u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
5.0mm x 3.2mm x 0.85mm |
Blank (User Must Program) |
2013 |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.197Lx0.126W 5.00mmx3.20mm |
1.8V |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001BL5
Microchip Technology |
437 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
10 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
e4 |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
- |
- |
- |
3.3V |
-40u00b0C~105u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
5.0mm x 3.2mm x 0.85mm |
Blank (User Must Program) |
- |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.197Lx0.126W 5.00mmx3.20mm |
1.8V |
55/45% |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001CI2
Microchip Technology |
907 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
25 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
- |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
- |
- |
- |
3.3V |
-40u00b0C~85u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
3.2mm x 2.5mm x 0.85mm |
Blank (User Must Program) |
- |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.126Lx0.098W 3.20mmx2.50mm |
1.8V |
55/45% |
- |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001CI5
Microchip Technology |
418 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
10 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
e4 |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
- |
- |
- |
3.3V |
-40u00b0C~85u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
3.2mm x 2.5mm x 0.85mm |
Blank (User Must Program) |
- |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.126Lx0.098W 3.20mmx2.50mm |
1.8V |
55/45% |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001CL2
Microchip Technology |
1 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
25 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
e4 |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
4 |
- |
- |
3.3V |
-40u00b0C~105u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
3.2mm x 2.5mm x 0.85mm |
Blank (User Must Program) |
- |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.126Lx0.098W 3.20mmx2.50mm |
1.8V |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001CL5
Microchip Technology |
488 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
10 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
e4 |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
- |
- |
- |
3.3V |
-40u00b0C~105u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
3.2mm x 2.5mm x 0.85mm |
Blank (User Must Program) |
- |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.126Lx0.098W 3.20mmx2.50mm |
1.8V |
55/45% |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001DI2
Microchip Technology |
7 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
25 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
e4 |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
4 |
- |
- |
3.3V |
-40u00b0C~85u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
2.5mm x 2.0mm x 0.85mm |
Blank (User Must Program) |
- |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.098Lx0.079W 2.50mmx2.00mm |
1.8V |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8001DL5
Microchip Technology |
13 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
15u03bcA |
- |
12 Weeks |
3ns |
150MHz |
- |
10 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
e4 |
- |
15pF |
55 % |
- |
12.2mA |
- |
- |
- |
1 (Unlimited) |
Surface Mount |
Surface Mount |
4 |
- |
- |
3.3V |
-40u00b0C~105u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
2.5mm x 2.0mm x 0.85mm |
Blank (User Must Program) |
2009 |
AEC-Q100 |
3ns |
ROHS3 Compliant |
DSC8001 |
0.098Lx0.079W 2.50mmx2.00mm |
1.8V |
- |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
- |
|
DSC8002AI1
Microchip Technology |
34 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
1u03bcA |
10mA |
12 Weeks |
- |
150MHz |
- |
50 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
- |
7.0104mm |
15pF |
55 % |
85u00b0C |
10mA |
3.6V |
-40u00b0C |
1.65V |
1 (Unlimited) |
Surface Mount |
Surface Mount |
- |
- |
- |
3.3V |
-40u00b0C~85u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
- |
Blank (User Must Program) |
2014 |
- |
- |
ROHS3 Compliant |
DSC8002 |
0.276Lx0.197W 7.00mmx5.00mm |
- |
- |
- |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
5.0038mm |
|
DSC8002BI2
Microchip Technology |
34 |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
1u03bcA |
10mA |
12 Weeks |
- |
150MHz |
- |
25 ppm |
Standby |
889u03bcm |
0.035 0.90mm |
- |
5.0038mm |
15pF |
55 % |
85u00b0C |
10mA |
3.6V |
-40u00b0C |
1.65V |
1 (Unlimited) |
Surface Mount |
Surface Mount |
- |
- |
- |
3.3V |
-40u00b0C~85u00b0C |
CMOS |
4-SMD, No Lead |
Tube |
Active |
- |
- |
Blank (User Must Program) |
- |
- |
- |
ROHS3 Compliant |
DSC8002 |
0.197Lx0.126W 5.00mmx3.20mm |
- |
- |
- |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
3.2004mm |
|
DSC8002DI2T
Microchip Technology |
- |
- |
|
- |
- |
1MHz~150MHz |
MEMS |
1u03bcA |
10mA |
- |
- |
150MHz |
- |
u00b125ppm |
Standby |
889u03bcm |
0.035 0.90mm |
- |
2.4892mm |
15pF |
55 % |
85u00b0C |
10mA |
3.6V |
-40u00b0C |
1.65V |
3 (168 Hours) |
Surface Mount |
Surface Mount |
- |
- |
- |
3.3V |
-40u00b0C~85u00b0C |
CMOS |
4-SMD, No Lead |
Tape & Reel (TR) |
Active |
- |
- |
Blank (User Must Program) |
- |
- |
- |
ROHS3 Compliant |
DSC8002 |
0.098Lx0.079W 2.50mmx2.00mm |
- |
- |
- |
Solder |
XO (Standard) |
- |
1.8V~3.3V |
2.0066mm |
