IC Adapters – Cybertant Technology

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3M (11)

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Analog Devices (1)

Aries Electronics (23)

DEGSON ELECTRONICS (27)

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Additional Feature
SOCKET ADAPTER (8)

STANDARD: UL 94V-0 (4)
Board Material
FR4 Epoxy Glass (3)
Body Breadth
0.7 inch (3)
Body Depth
0.3 inch (3)
Body material
polyamide (1)
Body Material
Glass, Polysulfone (2)
Certificates
RoHS compliant (1)
Colour
orange (1)
Connector
terminal (1)
Connector pinout layout
1x2 (1)
Connectors features
assembling possibility (1)
Contact Finish - Post
Tin (7)

Tin-Lead (3)

Gold (5)
Contact Finish Mating
Gold (15)
Contact Finish Thickness - Mating
30.0u03bcin 0.76u03bcm (10)

10.0u03bcin 0.25u03bcm (5)
Contact Finish Thickness - Post
200.0u03bcin 5.08u03bcm (10)

10.0u03bcin 0.25u03bcm (3)

30.0u03bcin 0.76u03bcm (4)
Contact Material - Mating
Beryllium Copper (15)
Contact Material - Post
Brass (13)

Beryllium Copper (4)
Contact Materials
Copper (8)

copper alloy (1)
Contact Plating
Gold, Tin (1)

Tin (2)

Gold (5)
Contact plating
tinned (1)
Contact Style
RND PIN-SKT (6)
Contacts pitch
3.5mm (1)
Convert From (Adapter End)
DIP, 0.3 (7.62mm) Row Spacing (10)

DIP, 0.6 (15.24mm) Row Spacing (4)

SOJ (1)

SSOP (1)

DIP, 0.4 (10.16mm) Row Spacing (1)
Convert To (Adapter End)
DIP, 0.6 (15.24mm) Row Spacing (4)

DIP, 0.3 (7.62mm) Row Spacing (7)

JEDEC (1)

SOIC (3)

SOWIC (1)

DIP, 0.4 (10.16mm) Row Spacing (1)
Current Rating
3A (6)

1A (5)
Current rating
10A (1)
Current Rating (Amps)
3A (6)

1A (4)
Depth
8.3mm (1)

25.4mm (1)

6.9mm (1)
Device Socket Type
IC SOCKET (12)
ECCN Code
EAR99 (12)
Electrical mounting
cage clamp (1)
Electrical mounting1
THT (1)
Factory Lead Time
5 Weeks (12)

6 Weeks (1)

8 Weeks (4)
Features
Closed Frame (2)
Flammability Rating
UL94 V-0 (10)
Flammability rating
UL94V-2 (1)
Function
PLC - other devices (1)
Gender
Female (4)
Gross weight
1.148g (1)
Height
2.29mm (4)

1.58mm (3)

12.8mm (1)
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled (11)

Polysulfone (PSU), Glass Filled (4)
Insulation Resistance
1GOhm (1)
JESD-609 Code
e3 (7)

e0 (4)

e4 (1)
Lead Free
Lead Free (9)

Contains Lead (2)
Lead Length
3.302mm (2)

3.175mm (1)

762u03bcm (1)
Lead Pitch
2.54mm (7)
Length
30.5mm (2)

35.6mm (2)

11.1mm (1)

1 (1)

40.1mm (1)

40.5mm (1)
Material
Polyester (1)
Material Flammability Rating
UL94 V-0 (15)
Max Operating Temperature
105u00b0C (4)

150u00b0C (4)
Mechanical mounting
on PCBs (1)
Min Operating Temperature
-55u00b0C (8)
Moisture Sensitivity Level (MSL)
1 (Unlimited) (17)
Mount
Through Hole (4)

Surface Mount (2)

Wire (2)

Through Hole, Wire (1)
Mounting Type
Through Hole (14)

Surface Mount (3)
Number of Contacts
14 (4)

24 (3)

28 (3)

16 (2)

8 (1)

20 (3)
Number of Pins
14 (4)

16 (2)

8 (1)

18 (1)

20 (3)

24 (1)

28 (1)
Number of Positions
24 (3)

28 (3)

18 (1)

14 (1)

20 (1)
Number of Rows
2 (11)
Number of ways
2 (1)
Operating Temperature
105u00b0C (1)

-55u00b0C~125u00b0C (4)
Operating temperature
-50...100u00b0C (1)
Orientation
Straight (2)
Package / Case
TO-8 (1)

SOIC (2)
Packaging
Bulk (3)
Part Status
Active (17)
Pbfree Code
yes (7)
PCB Contact Pattern
RECTANGULAR (6)
PCB Contact Row Spacing
0.6 mm (1)

0.3 mm (1)
Pitch
2.54mm (3)

1.78mm (1)
Pitch - Mating
0.100 2.54mm (14)

0.050 1.27mm (1)

0.026 0.65mm (1)

0.070 1.78mm (1)
Pitch - Post
0.100 2.54mm (11)

0.050 1.27mm (4)

0.070 1.78mm (1)
Published
2006 (12)

2012 (1)

2009 (1)

2011 (2)

2001 (1)
Rated voltage
300V (1)
REACH SVHC
No SVHC (5)
RoHS Status
ROHS3 Compliant (10)

Non-RoHS Compliant (3)

RoHS Compliant (4)
Row Spacing
7.62 mm (7)

15.24 mm (2)

10.16 mm (1)
Series
Correct-A-Chipu00ae 1106396 (3)

Correct-A-Chipu00ae 1107254 (3)

Correct-A-Chipu00ae 1109522 (1)

Correct-A-Chipu00ae 354000 (3)

Correct-A-Chipu00ae 354W00 (1)

Correct-A-Chipu00ae 350000 (1)

Correct-A-Chipu00ae 351000 (1)

Textoolu2122 (4)
Spatial orientation
angled 90u00b0 (1)
Termination
Solder (15)

Wire Wrap (2)
Termination Post Length
0.130 3.30mm (7)

0.125 3.18mm (3)

0.030 0.76mm (1)

0.620 15.75mm (2)
Type of connector
PCB terminal block (1)
Weight
453.59237g (3)
Width
6.9mm (1)

27.9mm (1)
Wire cross-section
1.5mm2 (1)
Wire size
28AWG...14AWG (1)

Categories

IC Adapters

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100 Results

Product	Inventory	Pricing(USD)	Datasheet	RoHS	Additional Feature	Board Material	Body Breadth	Body Depth	Body material	Body Material	Certificates	Colour	Connector	Connector pinout layout	Connectors features	Contact Finish - Post	Contact Finish Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Material - Mating	Contact Material - Post	Contact Materials	Contact Plating	Contact plating	Contact Style	Contacts pitch	Convert From (Adapter End)	Convert To (Adapter End)	Current Rating	Current rating	Current Rating (Amps)	Depth	Device Socket Type	ECCN Code	Electrical mounting	Electrical mounting1	Factory Lead Time	Features	Flammability Rating	Flammability rating	Function	Gender	Gross weight	Height	Housing Material	Insulation Resistance	JESD-609 Code	Lead Free	Lead Length	Lead Pitch	Length	Material	Material Flammability Rating	Max Operating Temperature	Mechanical mounting	Min Operating Temperature	Moisture Sensitivity Level (MSL)	Mount	Mounting Type	Number of Contacts	Number of Pins	Number of Positions	Number of Rows	Number of ways	Operating Temperature	Operating temperature	Orientation	Package / Case	Packaging	Part Status	Pbfree Code	PCB Contact Pattern	PCB Contact Row Spacing	Pitch	Pitch - Mating	Pitch - Post	Published	Rated voltage	REACH SVHC	RoHS Status	Row Spacing	Series	Spatial orientation	Termination	Termination Post Length	Type of connector	Weight	Width	Wire cross-section	Wire size
1066500000 Weidmuller	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
1106396-14 Aries Electronics	-	-	-		SOCKET ADAPTER	-	-	-	-	-	-	-	-	-	-	Tin	Gold	30.0u03bcin 0.76u03bcm	200.0u03bcin 5.08u03bcm	Beryllium Copper	Brass	-	-	-	RND PIN-SKT	-	DIP, 0.3 (7.62mm) Row Spacing	DIP, 0.6 (15.24mm) Row Spacing	3A	-	-	-	IC SOCKET	EAR99	-	-	5 Weeks	-	UL94 V-0	-	-	-	-	-	Polyamide (PA46), Nylon 4/6, Glass Filled	-	e3	-	3.302mm	2.54mm	-	-	UL94 V-0	-	-	-	1 (Unlimited)	Through Hole	Through Hole	14	14	-	2	-	-	-	-	-	-	Active	yes	RECTANGULAR	0.6 mm	-	0.100 2.54mm	0.100 2.54mm	2006	-	-	ROHS3 Compliant	-	Correct-A-Chipu00ae 1106396	-	Solder	0.130 3.30mm	-	-	-	-	-
1106396-24 Aries Electronics	-	-	-		SOCKET ADAPTER	-	-	-	-	-	-	-	-	-	-	Tin	Gold	30.0u03bcin 0.76u03bcm	200.0u03bcin 5.08u03bcm	Beryllium Copper	Brass	-	-	-	RND PIN-SKT	-	DIP, 0.3 (7.62mm) Row Spacing	DIP, 0.6 (15.24mm) Row Spacing	-	-	3A	-	IC SOCKET	EAR99	-	-	5 Weeks	-	-	-	-	-	-	2.29mm	Polyamide (PA46), Nylon 4/6, Glass Filled	-	e3	Lead Free	-	2.54mm	30.5mm	-	UL94 V-0	-	-	-	1 (Unlimited)	-	Through Hole	24	-	24	2	-	-	-	-	-	-	Active	yes	RECTANGULAR	-	-	0.100 2.54mm	0.100 2.54mm	2006	-	No SVHC	ROHS3 Compliant	7.62 mm	Correct-A-Chipu00ae 1106396	-	Solder	0.130 3.30mm	-	-	-	-	-
1106396-28 Aries Electronics	-	-	-		SOCKET ADAPTER	-	-	-	-	-	-	-	-	-	-	Tin	Gold	30.0u03bcin 0.76u03bcm	200.0u03bcin 5.08u03bcm	Beryllium Copper	Brass	Copper	Gold, Tin	-	RND PIN-SKT	-	DIP, 0.3 (7.62mm) Row Spacing	DIP, 0.6 (15.24mm) Row Spacing	-	-	3A	-	IC SOCKET	EAR99	-	-	5 Weeks	-	-	-	-	-	-	2.29mm	Polyamide (PA46), Nylon 4/6, Glass Filled	-	e3	Lead Free	-	2.54mm	35.6mm	-	UL94 V-0	-	-	-	1 (Unlimited)	-	Through Hole	28	-	28	2	-	-	-	-	-	Bulk	Active	yes	RECTANGULAR	-	-	0.100 2.54mm	0.100 2.54mm	2006	-	No SVHC	ROHS3 Compliant	7.62 mm	Correct-A-Chipu00ae 1106396	-	Solder	0.130 3.30mm	-	-	-	-	-
1107254-16 Aries Electronics	-	-	-		SOCKET ADAPTER	-	0.7 inch	0.3 inch	-	-	-	-	-	-	-	Tin	Gold	30.0u03bcin 0.76u03bcm	200.0u03bcin 5.08u03bcm	Beryllium Copper	Brass	-	-	-	RND PIN-SKT	-	DIP, 0.6 (15.24mm) Row Spacing	DIP, 0.3 (7.62mm) Row Spacing	3A	-	-	-	IC SOCKET	EAR99	-	-	5 Weeks	-	UL94 V-0	-	-	-	-	-	Polyamide (PA46), Nylon 4/6, Glass Filled	-	e3	-	3.302mm	2.54mm	-	-	UL94 V-0	-	-	-	1 (Unlimited)	Through Hole	Through Hole	16	16	-	2	-	-	-	-	-	Bulk	Active	yes	RECTANGULAR	0.3 mm	-	0.100 2.54mm	0.100 2.54mm	2006	-	-	ROHS3 Compliant	-	Correct-A-Chipu00ae 1107254	-	Solder	0.130 3.30mm	-	-	-	-	-
1107254-24 Aries Electronics	-	-	-		SOCKET ADAPTER	-	0.7 inch	0.3 inch	-	-	-	-	-	-	-	Tin	Gold	30.0u03bcin 0.76u03bcm	200.0u03bcin 5.08u03bcm	Beryllium Copper	Brass	Copper	-	-	RND PIN-SKT	-	DIP, 0.6 (15.24mm) Row Spacing	DIP, 0.3 (7.62mm) Row Spacing	-	-	3A	-	IC SOCKET	EAR99	-	-	5 Weeks	-	-	-	-	-	-	2.29mm	Polyamide (PA46), Nylon 4/6, Glass Filled	-	e3	Lead Free	-	2.54mm	30.5mm	-	UL94 V-0	-	-	-	1 (Unlimited)	-	Through Hole	24	-	24	2	-	-	-	-	-	Bulk	Active	yes	RECTANGULAR	-	-	0.100 2.54mm	0.100 2.54mm	2006	-	No SVHC	ROHS3 Compliant	15.24 mm	Correct-A-Chipu00ae 1107254	-	Solder	0.130 3.30mm	-	-	-	-	-
1107254-28 Aries Electronics	-	-	-		SOCKET ADAPTER	-	0.7 inch	0.3 inch	-	-	-	-	-	-	-	Tin	Gold	30.0u03bcin 0.76u03bcm	200.0u03bcin 5.08u03bcm	Beryllium Copper	Brass	Copper	-	-	RND PIN-SKT	-	DIP, 0.6 (15.24mm) Row Spacing	DIP, 0.3 (7.62mm) Row Spacing	-	-	3A	-	IC SOCKET	EAR99	-	-	5 Weeks	-	-	-	-	-	-	2.29mm	Polyamide (PA46), Nylon 4/6, Glass Filled	-	e3	Lead Free	-	2.54mm	35.6mm	-	UL94 V-0	-	-	-	1 (Unlimited)	-	Through Hole	28	-	28	2	-	-	-	-	-	-	Active	yes	RECTANGULAR	-	-	0.100 2.54mm	0.100 2.54mm	2006	-	No SVHC	ROHS3 Compliant	15.24 mm	Correct-A-Chipu00ae 1107254	-	Solder	0.130 3.30mm	-	-	-	-	-
1109522 Aries Electronics	-	-	-	-	STANDARD: UL 94V-0	FR4 Epoxy Glass	-	-	-	-	-	-	-	-	-	Tin-Lead	Gold	10.0u03bcin 0.25u03bcm	200.0u03bcin 5.08u03bcm	Beryllium Copper	Brass	-	-	-	-	-	DIP, 0.3 (7.62mm) Row Spacing	JEDEC	3A	-	-	-	IC SOCKET	EAR99	-	-	6 Weeks	-	UL94 V-0	-	-	-	-	-	Polyamide (PA46), Nylon 4/6, Glass Filled	-	e0	-	3.175mm	2.54mm	-	-	UL94 V-0	105u00b0C	-	-55u00b0C	1 (Unlimited)	Through Hole	Through Hole	8	8	-	2	-	-	-	-	TO-8	-	Active	-	-	-	-	0.100 2.54mm	-	2006	-	-	Non-RoHS Compliant	-	Correct-A-Chipu00ae 1109522	-	Solder	0.125 3.18mm	-	-	-	-	-
14-354000-11-RC Aries Electronics	-	-	-		STANDARD: UL 94V-0	-	-	-	-	-	-	-	-	-	-	-	Gold	10.0u03bcin 0.25u03bcm	10.0u03bcin 0.25u03bcm	Beryllium Copper	Brass	Copper	-	-	-	-	DIP, 0.3 (7.62mm) Row Spacing	SOIC	3A	-	-	-	IC SOCKET	EAR99	-	-	5 Weeks	-	UL94 V-0	-	-	-	-	-	Polyamide (PA46), Nylon 4/6, Glass Filled	-	e4	-	762u03bcm	-	-	Polyester	UL94 V-0	-	-	-	1 (Unlimited)	Surface Mount	Surface Mount	14	14	-	-	-	-	-	-	-	-	Active	yes	-	-	-	0.100 2.54mm	0.050 1.27mm	2006	-	No SVHC	ROHS3 Compliant	7.62 mm	Correct-A-Chipu00ae 354000	-	Solder	0.030 0.76mm	-	-	-	-	-
14-354W00-20 Aries Electronics	-	-	-		STANDARD: UL 94V-0	-	-	-	-	-	-	-	-	-	-	Tin-Lead	Gold	10.0u03bcin 0.25u03bcm	200.0u03bcin 5.08u03bcm	Beryllium Copper	Brass	-	-	-	-	-	DIP, 0.3 (7.62mm) Row Spacing	SOWIC	-	-	3A	-	IC SOCKET	EAR99	-	-	5 Weeks	-	-	-	-	-	-	-	Polyamide (PA46), Nylon 4/6, Glass Filled	-	e0	-	-	-	-	-	UL94 V-0	-	-	-	1 (Unlimited)	-	Through Hole	14	14	-	-	-	105u00b0C	-	-	-	-	Active	-	-	-	-	0.100 2.54mm	0.050 1.27mm	2012	-	-	ROHS3 Compliant	-	Correct-A-Chipu00ae 354W00	-	Solder	-	-	-	-	-	-
16-354000-20 Aries Electronics	-	-	-		STANDARD: UL 94V-0	-	-	-	-	-	-	-	-	-	-	-	Gold	10.0u03bcin 0.25u03bcm	10.0u03bcin 0.25u03bcm	Beryllium Copper	Brass	-	Tin	-	-	-	DIP, 0.3 (7.62mm) Row Spacing	SOIC	3A	-	-	-	IC SOCKET	EAR99	-	-	5 Weeks	-	UL94 V-0	-	-	-	-	1.58mm	Polyamide (PA46), Nylon 4/6, Glass Filled	-	e3	Lead Free	-	-	-	-	UL94 V-0	105u00b0C	-	-55u00b0C	1 (Unlimited)	-	Surface Mount	16	16	-	2	-	-	-	-	-	-	Active	-	-	-	-	0.100 2.54mm	0.050 1.27mm	2006	-	-	ROHS3 Compliant	7.62 mm	Correct-A-Chipu00ae 354000	-	Solder	-	-	-	-	-	-
1667750000 LM 3.50/02/90 3.2SN OR BX Weidmuller	-	-	-	-	-	-	-	-	polyamide	-	RoHS compliant	orange	terminal	1x2	assembling possibility	-	-	-	-	-	-	copper alloy	-	tinned	-	3.5mm	-	-	-	10A	-	8.3mm	-	-	cage clamp	THT	-	-	-	UL94V-2	-	-	1.148g	12.8mm	-	-	-	-	-	-	11.1mm	-	-	-	on PCBs	-	-	-	-	-	-	-	-	2	-	-50...100u00b0C	-	-	-	-	-	-	-	-	-	-	-	300V	-	-	-	-	angled 90u00b0	-	-	PCB terminal block	-	-	1.5mm2	28AWG...14AWG
18-354000-10 Aries Electronics	-	-	-		-	-	-	-	-	-	-	-	-	-	-	Gold	Gold	10.0u03bcin 0.25u03bcm	10.0u03bcin 0.25u03bcm	Beryllium Copper	Brass	-	Gold	-	-	-	DIP, 0.3 (7.62mm) Row Spacing	SOIC	3A	-	3A	-	-	-	-	-	5 Weeks	-	UL94 V-0	-	-	-	-	-	Polyamide (PA46), Nylon 4/6, Glass Filled	-	-	-	-	-	-	-	UL94 V-0	-	-	-	1 (Unlimited)	Surface Mount	Surface Mount	-	18	18	-	-	-	-	-	SOIC	-	Active	-	-	-	-	0.100 2.54mm	0.050 1.27mm	2006	-	-	ROHS3 Compliant	-	Correct-A-Chipu00ae 354000	-	Solder	-	-	-	-	-	-
20-350001-10 Aries Electronics	-	-	-	-	SOCKET ADAPTER	FR4 Epoxy Glass	-	-	-	-	-	-	-	-	-	Tin	-	-	200.0u03bcin 5.08u03bcm	-	Brass	-	-	-	-	-	SOJ	DIP, 0.3 (7.62mm) Row Spacing	-	-	-	-	IC SOCKET	EAR99	-	-	5 Weeks	-	-	-	-	-	-	1.58mm	-	-	e0	Contains Lead	-	-	-	-	-	105u00b0C	-	-55u00b0C	1 (Unlimited)	-	Through Hole	20	20	-	2	-	-	-	-	SOIC	-	Active	-	-	-	-	0.050 1.27mm	0.100 2.54mm	2006	-	-	Non-RoHS Compliant	7.62 mm	Correct-A-Chipu00ae 350000	-	Solder	0.125 3.18mm	-	-	-	-	-
20-351000-10 Aries Electronics	-	-	-	-	SOCKET ADAPTER	FR4 Epoxy Glass	-	-	-	-	-	-	-	-	-	Tin-Lead	-	-	200.0u03bcin 5.08u03bcm	-	Brass	-	Tin	-	-	-	SSOP	DIP, 0.3 (7.62mm) Row Spacing	1A	-	-	-	IC SOCKET	EAR99	-	-	5 Weeks	-	-	-	-	-	-	1.58mm	-	-	e0	Contains Lead	-	-	-	-	-	105u00b0C	-	-55u00b0C	1 (Unlimited)	-	Through Hole	20	20	-	2	-	-	-	-	-	-	Active	-	-	-	-	0.026 0.65mm	0.100 2.54mm	2009	-	-	Non-RoHS Compliant	7.62 mm	Correct-A-Chipu00ae 351000	-	Solder	0.125 3.18mm	-	-	-	-	-
2065100010 Weidmuller	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	PLC - other devices	-	-	-	-	-	-	-	-	-	1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
214-3339-19-0602J 3M	29	-	-		-	-	-	-	-	Glass, Polysulfone	-	-	-	-	-	Gold	Gold	30.0u03bcin 0.76u03bcm	30.0u03bcin 0.76u03bcm	Beryllium Copper	Beryllium Copper	Copper	Gold	-	-	-	DIP, 0.3 (7.62mm) Row Spacing	DIP, 0.3 (7.62mm) Row Spacing	1A	-	1A	-	-	-	-	-	8 Weeks	Closed Frame	UL94 V-0	-	-	Female	-	-	Polysulfone (PSU), Glass Filled	-	-	Lead Free	-	-	-	-	UL94 V-0	150u00b0C	-	-55u00b0C	1 (Unlimited)	Wire	Through Hole	14	14	14	2	-	-55u00b0C~125u00b0C	-	Straight	-	-	Active	-	-	-	2.54mm	0.100 2.54mm	0.100 2.54mm	2011	-	-	RoHS Compliant	7.62 mm	Textoolu2122	-	Wire Wrap	0.620 15.75mm	-	453.59237g	-	-	-
220-3342-19-0602J 3M	56	-	-		-	-	-	-	-	-	-	-	-	-	-	Gold	Gold	30.0u03bcin 0.76u03bcm	30.0u03bcin 0.76u03bcm	Beryllium Copper	Beryllium Copper	Copper	Gold	-	-	-	DIP, 0.3 (7.62mm) Row Spacing	DIP, 0.3 (7.62mm) Row Spacing	1A	-	1A	25.4mm	-	-	-	-	8 Weeks	Closed Frame	UL94 V-0	-	-	Female	-	-	Polysulfone (PSU), Glass Filled	-	-	Lead Free	-	-	40.1mm	-	UL94 V-0	150u00b0C	-	-55u00b0C	1 (Unlimited)	Through Hole, Wire	Through Hole	20	20	20	-	-	-55u00b0C~125u00b0C	-	-	-	-	Active	-	-	-	2.54mm	0.100 2.54mm	0.100 2.54mm	2011	-	-	RoHS Compliant	-	Textoolu2122	-	Wire Wrap	0.620 15.75mm	-	453.59237g	6.9mm	-	-
224-1275-39-0602J 3M	56	-	-		-	-	-	-	-	-	-	-	-	-	-	Gold	Gold	30.0u03bcin 0.76u03bcm	30.0u03bcin 0.76u03bcm	Beryllium Copper	Beryllium Copper	Copper	Gold	-	-	-	DIP, 0.6 (15.24mm) Row Spacing	DIP, 0.6 (15.24mm) Row Spacing	1A	-	1A	-	-	-	-	-	8 Weeks	-	UL94 V-0	-	-	Female	-	-	Polysulfone (PSU), Glass Filled	-	-	Lead Free	-	-	-	-	UL94 V-0	150u00b0C	-	-55u00b0C	1 (Unlimited)	Wire	Through Hole	24	24	24	-	-	-55u00b0C~125u00b0C	-	-	-	-	Active	-	-	-	2.54mm	0.100 2.54mm	0.100 2.54mm	2006	-	-	RoHS Compliant	-	Textoolu2122	-	Solder	-	-	453.59237g	-	-	-
228-1290-09-0602J 3M	-	-	-		-	-	-	-	-	Glass, Polysulfone	-	-	-	-	-	Gold	Gold	30.0u03bcin 0.76u03bcm	30.0u03bcin 0.76u03bcm	Beryllium Copper	Beryllium Copper	Copper	Gold	-	-	-	DIP, 0.4 (10.16mm) Row Spacing	DIP, 0.4 (10.16mm) Row Spacing	1A	-	1A	6.9mm	-	-	-	-	8 Weeks	-	UL94 V-0	-	-	Female	-	-	Polysulfone (PSU), Glass Filled	1GOhm	-	Lead Free	-	-	40.5mm	-	UL94 V-0	150u00b0C	-	-55u00b0C	1 (Unlimited)	Through Hole	Through Hole	28	28	28	-	-	-55u00b0C~125u00b0C	-	Straight	-	-	Active	-	-	-	1.78mm	0.070 1.78mm	0.070 1.78mm	2001	-	-	RoHS Compliant	10.16 mm	Textoolu2122	-	Solder	0.130 3.30mm	-	-	27.9mm	-	-

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