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Xilinx Inc. XCCACEM32-BG388I
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Xilinx Inc. XCCACEM32-BG388I

Xilinx Inc.

Manufacturer No:

XCCACEM32-BG388I

Manufacturer:

Xilinx Inc.

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ECAD Model:

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Description:

MODULE FLASH 32MB 388BBGA

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Xilinx Inc. XCCACEM32-BG388I information

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Xilinx Inc. XCCACEM32-BG388I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCCACEM32-BG388I.
ParameterValue
Package / Case 388-BBGA
Surface Mount YES
Number of Pins 388
Memory Types FLASH
Published 1999
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 388
Terminal Finish TIN LEAD
Max Operating Temperature 85u00b0C
Min Operating Temperature -40u00b0C
HTS Code 8542.32.00.71
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Frequency 133MHz
Pin Count 388
Supply Voltage-Max (Vsup) 1.89V
Power Supplies 1.83.3V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.71V
Memory Size 32MB
Organization 2MX16
Memory Width 16
Memory Density 33554432 bit
Parallel/Serial SERIAL
Endurance 1000000 Write/Erase Cycles
Data Retention Time-Min 20
Height Seated (Max) 2.87mm
Length 35mm
Width 35mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

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